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Sunday, May 10, 2020 | History

3 edition of International patents for electronic cooling technology found in the catalog.

International patents for electronic cooling technology

International patents for electronic cooling technology

  • 82 Want to read
  • 17 Currently reading

Published by Marcel Dekker in New York .
Written in English

    Subjects:
  • Electronic apparatus and appliances -- Cooling -- Patents.,
  • Semiconductors -- Cooling -- Patents.

  • Edition Notes

    Statementcompiled by Arthur Bross, Thomas J. Walsh.
    ContributionsBross, Arthur, 1928-, Walsh, Thomas J., 1931-
    Classifications
    LC ClassificationsTK7870.25 .I55 1994
    The Physical Object
    Pagination6 v. (xx, 5932 p.) :
    Number of Pages5932
    ID Numbers
    Open LibraryOL1083565M
    ISBN 100824792025, 0824792033, 0824792041, 082479205X, 0824792068, 0824792076
    LC Control Number94007237

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International patents for electronic cooling technology Download PDF EPUB FB2

Our company's focus on innovation is manifest in the many patents authored by CCS executives and staff. These patents mark CCS advancements in cooling tower structure and improved cooling tower thermal performance.

Patents Owned by CCS. US Patent No. 7, Tower/Frame Structure and Components for Same. A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange assembly disposed within the cover of the portable computer.

The heat exchange assembly includes a hollow channel for carrying coolant, as well Cited by: Five groups, including Mayo, held patents for some part of the process.

They were able to come to an agreement that allowed manufacturing of cortisone by employing a third-party, non-profit entity. But Dr. Kendall and his lab were also patent holders. They were awarded patents for the steps involved in taking compound E on its journey to : Bobnellis.

Abstract: The present invention provides a replaceable water-cooled radiating device, comprising a water-cooling module and a light-emitting module, the water-cooling module is provided with a control circuit, and the control circuit is provided with at least one electrical connector.

The light-emitting module is disposed on a top of the water-cooling module and is provided with a driving. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to International patents for electronic cooling technology book dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading.

Abstract: A cooling tower having an evaporative media along with a liquid distribution system that distributes hot liquid over the evaporative media. The cooling tower includes a pair of heat exchanger modules that each have a first set of passageways in fluid communication with a first flow duct and a second set of passageways in fluid communication with a second flow duct.

The LEM cooling technology provided the capability to support chip heat fluxes of 15 to 20 W/m 2 and module heat loads up to W. Thermal management has become a major limitation for the electronic industry.

The utilization of extremely small transistors at high operating frequencies(GHz) generate a significant amount of heat which is. Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials.

A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. Such an instrument is also called a.

invalidation proceedings by Patexia IP and Unified Patents. Named “LITIGATION COUNSEL OF THE YEAR” by Cisco Systems, Inc., a leading global provider of networking products and services, as a result of Duane Morris’ work for Cisco on patent litigation matters.

PATENTS AND TECHNOLOGY 1. Searching or applying for registration of exclusive rights for an invention, a product or a process. Services and information. Understanding patents. The types of new or improved innovations that can, and should, be protected by patents.

Guide to patents. Patents and patenting procedures, including how to get started with your patent application.

In order to remove heat from integrated circuit modules a layered aluminum heat transfer structure is secured to the upper portion of a circuit board. The heat transfer structure includes a number of heat pipes for transferring heat to a condenser region.

Each heat pipe is composed of a central vapor channel with a number of parallel capillary channels, each of which is open on one side to the Cited by: Ministry of Electronics and Information Technology has launched a scheme, Support for International Patent Protection in E&IT to provide financial support to MSMEs and Technology Startup units for international patent filing to encourage innovation and recognize the value and capabilities of global IP along with capturing growth opportunities in ICTE sector.

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Bentham Science answers the information needs of scientists in the fields of pharmaceutical, biomedical, medical, engineering, technology, computer and social sciences.

Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and pac.

Science, Technology and Patents. OECD Science Technology and Industry Outlook. Science Technology and Industry Outlook Comparative performance of national science and innovation systems. Electronic Cooling/Packaging Seminar Series Dr. Chia-Pin Chiu Manager of the Thermal Core Competency group, Intel Chia-Pin Chiu is leading Packaging Pathfinding at Intel Corporation in Chandler, Arizona, where he is responsible for packaging technology research and development.

His major research included thermal interface materials, thermal. Contact Us. ASL AMERICAN SUPERLITE CANTARA ST UNIT 5 NORTH HOLLYWOOD, CA ; Toll Free: Phone: Fax: The Information Technology Team provides patentability advice and analysis of all types of computer-implemented methods, business processes, and software inventions for use in hardware systems.

We work with our clients to identify transformative processes and explore how these processes are tied to a particular computing device. Areas of Focus: Computer Science and Technology Software. The journal is essential reading for all researchers involved in materials science.

The journal also covers recent research (where patents have been registered) in fast emerging areas of materials science, biomaterials, biological materials, magnetic materials, medical implant materials, nanomaterials, ceramics, plastics, polymers, semi-conductors, coatings, composites, paper, wood, textile.

Reverse Engineering, in the world of Patents and IP, is typically utilized to determine if there is unauthorized use of someone else’s Intellectual Property in a product or process.

The team at TechPats is here to aid your investigation of potentially infringing systems, devices, and components through RE and testing. Testing and Lab Services.cooling technology, balance of system, and high level package thermal analysis •ORNL will focus their work on wide-band gap materials in preparation for FY12 high temperature air cooled inverter design – FY •NREL’s air cooling thermal system research will be used to provide useful air cooling system thermal design information.Liquid Cooling of Electronic Devices by Single-Phase Convection [Incropera, Frank P.] on *FREE* shipping on qualifying offers.

Liquid Cooling of Electronic Devices by Single-Phase ConvectionCited by: